Aquasink was developed to provide the design engineer with a rugged, high performance, liquid cooled mounting platform for high power, isolated base semiconductors and other heat sensitive components. Aquasink is based on a broad mechanical envelope allowing for complete flexibility of design …more

Aquamax copper provides additional performance over aluminum using the same proprietry channeling techniques as aluminum. The vacuum brazed, flux free joint ensures leak and corrosion free construction. Typical external finish is RoHS compliant electroless nickel. …more

Aquamax provides maximum thermal performance in aluminum by employing proprietary channeling techniques to maximize coolant velocity at low head loss while providing uniform temperature across the mounting surface. Precision machining techniques used at the vacuum braze, flux free, interface ensure leak and corrosion free construction. Typical external finish is RoHS compliant trivalent chrome. …more

Copper or aluminum tubes are embedded in the surface of an aluminum plate to provide the lowest thermal resistance between the semiconductor mounting surface and the cooling liquid. Tubes can be bent into complex arrays to ensure the copper surface is directly under the semiconductor chips. …more

Patented technology provides the highest performance vacuum brazed, flux free Press Pack Coolers in both aluminum and copper construction. …more